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IPC-A-610 CIS |
Students will learn the requirements for electronic
assembly during a 3-4 day presentation and review of the IPC-A-610
Specifications. Mixing the classroom lecture with a 600+ slide presentation
along with actual soldering demonstrations and classroom discussions allows
students to gain a greater understanding of the Specification requirements.
The entire course is 9 modules in all. Modules 1 and
2 are prerequisites for the course. The rest of the modules are optional
allowing companies to choose only the subjects that meet their respective
requirements.
Each day, students receive a full review and be tested
on the information for all of the topics covered.
Course Modules:
MODULE 1 AND 2
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IPC Policies and
Procedures |
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Specialized
Designs |
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Terms and
Definitions |
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Examples and
Illustrations |
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Inspection
Methodology |
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Magnification
Aids and Lighting |
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Applicable
Documents |
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Handling
Electronic Assemblies |
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EOS/ESD
Prevention |
MODULE 3
Hardware Installation
| Connectors, Handles, Extractors, Latches |
| Connector Pins |
Wire Bundle Securing
Wire Routing
MODULE 4
Soldering Acceptability Requirements and associated
anomalies
Hi Voltage Soldering
MODULE 5
Terminal Connections
| Edge Clips |
| Swaged Hardware |
Wire/Lead Preparation
| Lead Forming |
| Service Loops |
| Terminals- Stress Relief Lead/Wire Bend |
| Lead/Wire Placement |
| Insulation |
| Wires |
| Attachment and Soldering Requirements for Solder
Terminals |
MODULE 6
Through-Hole Technology
| Component Mounting |
| Heat sinks |
| Component Securing |
| Supported and Unsupported Holes |
| Jumper wires |
MODULE 7
Surface Mount Assemblies
| Staking Adhesives |
| Common SMT Connections |
| Bottom Only Termination Chip Components |
| Rectangular or Square End Components |
| Cylindrical End Cap/MELF |
| Castellated Terminations |
| Flat Ribbon, L, and Gull Wing Leads |
| Round or Flattened (Coined) Leads |
| J Leads |
| Butt/I Connections |
| Flat Lug Leads |
| Tall Profile Components |
| Inward Formed L-Shaped Ribbon Leads |
| Ball Grid Array/Surface Mount Area Array Packages |
| Plastic Quad Flat Pack – No Leads |
| Components with Bottom Thermal Plane Terminations |
| Jumper Wires |
MODULE 8
Component Damage
| Loss of Metallization & Leaching |
| Chip Resistor Element |
| Leaded/Leadless Devices |
| Connectors |
Printed Circuit Boards and Assemblies
| Gold Fingers |
| Laminate Conditions |
| Marking |
| Cleanliness |
| Coatings (Conformal Coating/Solder Resist) |
MODULE 9
Discrete Wiring
| Solderless Wrap |
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For more information about this course, email
registrar@technicaltrainingctr.com.
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